NEC Develops Heat Conducting Bioplastic for Mobile Phones
April 10, 2007 2:02 PM | Technology | Comments (0)
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NEC Corporation has developed a new kind of bioplastic composed of plant-based material and carbon fiber, which realizes heat conductivity higher than that of stainless steel. This new technology will help small-sized electronic products such as mobile phones and personal computers resolve the excess build of heat when being used. The innovative bioplastic is expected to make electronic products more environmentally sound, while solving conventional heat release issues.
The features of the new bioplastic are as follows.
1) Creation of a cross-linked structure of carbon fiber. This enables good heat conductivity in the plane direction of the PLA resin board, which is a characteristic conventionally difficult to attain in metal boards.
2) The composite is extremely environmentally friendly as it is mainly composed of biomass-based components including the binder (the biomass ratio exceeds 90%, excluding inorganic components such as the carbon fiber).
3) The strength and moldability of the composite have been fundamentally verified for use in electronic products.
NEC's newly developed bioplastic composite in the housings of electronic products easily releases the heat generated from electronic parts with high temperatures through whole housing surfaces, while slowing up an increase in the temperature of the housings near parts.
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