News | Reviews | Shop | Forum | Downloads | Phone Finder
 

cell phone news

Narrow your search for Phones | News | Reviews

 

 

 

 News Categories

 

Shop for Cell

 

     
     

Enter your email

 

 

   

Qualcomm Announces Next-Generation Bluetooth Experience

May 28, 2008 5:28 PM | Technology | Comments (0)

Qualcomm Incorporated today announced the latest addition to its line of Bluetooth solutions which delivers an enhanced user experience and significant advantages for handset manufacturers. Bluetooth technology provides short-range wireless connectivity between handsets headsets and other Bluetooth-enabled devices.

Qualcomm's new BTS4025 system-on-a-chip (SoC) - which is now sampling - offers full support for the latest Bluetooth 2.1 + Enhanced Data Rate (EDR) specification, as well as improved radio-frequency performance in a significantly smaller, more power-efficient package than previous Bluetooth chips. The technology innovations found in the BTS4025 SoC enable better Bluetooth performance, which can now be more readily available in mid- to low-tier handsets requiring lower costs and smaller form factor solutions.

 

The BTS4025 SoC's compact 3.2 x 2.9mm chip scale package is significantly smaller than any comparable solution. The BTS4025 SoC requires very few external components and can use the existing system clock, allowing for both space savings and easy integration. The BTS4025 SoC extends battery life by reducing the stand-by current consumption by up to 50 percent when the device is scanning for other Bluetooth devices. In addition, the BTS4025 SoC enables up to +13 dBm transmit power through efficient integration of a high-performance on-chip power amplifier. The increased output power improves the connection reliability and range between Bluetooth device pairs, such as handsets and headsets, to enhance the end user experience.

Qualcomm's BTS4025 SoC solution is optimized for interfacing with certain Mobile Station Modem (MSM) chipsets and Qualcomm Single Chip (QSC) solutions that provide the complete Bluetooth upper layer stack and profiles, giving device manufacturing partners complete turnkey Bluetooth solutions for mobile handsets. The first handsets using the new chips should be available on the market later this year.

Recent Related News:

 

AddThis Social Bookmark Button    AddThis Feed Button   

Post a comment


Visit our Forum to participate in discussions about cell phones!

Copyright 2006 - Cell Phone Digest | Cell phone News, Reviews & Sales

About Us | Contact Us | Privacy Policy | Advertising

 

 Sister Sites: mZeus.com | Insurance For Everything.com | Warrior Fitness World | Money Cake

Gambling Digest | Stunster | Favors for Sale | How I Failed | Pat's Wedding | Unique-Dating