Qualcomm Demos Media FLO & IntI' SDB-T Mobile TV on Multi-Mode Handset
May 13, 2008 11:28 AM | Cell Phone TV | Comments (0)
| Qualcomm has announced that it has successfully demonstrated the capability to support the MediaFLO and International Integrated Services Digital Broadcasting-Terrestrial (International ISDB-T) mobile TV standards on a multi-mode handset. Powered by Qualcomm's Universal Broadcast Modem (UBM) chipset, the technology demonstration illustrates that MediaFLO technology can complement the free-to-air ISDB-T One-Seg standard used in Japan and the ISDB-TB standard used in Brazil to enable a mix of free and paid mobile broadcast content and services to drive consumer adoption and revenue. The MediaFLO mobile broadcast platform enables the delivery of television content as well as value-added audio, video, data and interactive services and provides a means for broadcasters and operators to augment and monetize their existing International ISDB-T services. |  |
By employing both complementary technologies in a combined service offering, broadcasters and operators can offer free-to-air content using International ISDB-T, while providing a large number of pay TV channels and enhanced services over the MediaFLO platform to generate subscription revenue.
As Qualcomm supports both mobile TV technologies on a single chip, handset OEMs can achieve economies of scale in producing multi-mode, TV-enabled phones without incurring a significant increase to their bill of material costs.
The UBM solution delivers an unsurpassed level of integration to support the MediaFLO system, as well as DVB-H and one-segment implementations of ISDB-T. Designed as a companion to Qualcomm's CDMA2000 and WCDMA/UMTS Mobile Station Modem (MSM) chipsets, the UBM solution eliminates the need for additional dedicated application processors for more power-efficient devices with smaller form factors.
The MediaFLO / International ISDB-T mobile TV demonstrations can be seen at the Qualcomm booth A4 at the Tela Viva Movel conference in Sao Paulo, May 13-14 and at the Qualcomm booth C401 at the ExpoComm Japan show in Tokyo, July 22-24.
