Samsung Electronics Co. Ltd., a world leader in advanced semiconductor solutions, today introduced the industry’s first quad-core application processor built on the High-k Metal Gate (HKMG) low-power process technology. With unprecedented performance capabilities exceeding 1.4GHz based on the ARM® CORTEXTM A9 quad-core, the powerful, yet energy-efficient Exynos 4 Quad, allows system-level architects to integrate maximized power efficiencies into smartphones and tablets which enables double the processing power at a 20 percent lower power bill over its predecessor, the 45nm process-based Exynos 4 Dual.
“The quad-core processor offers phenomenal multitasking abilities surpassing any single or dual application processor. Since all the cores must share a single battery, the power management and efficiency in the limited battery capacity are indispensable for mobile computing devices,” said Taehoon Kim, vice president of System LSI marketing, Device Solutions, Samsung Electronics. “Given the diverse functionalities consumers are demanding from their mobile devices today, the Exynos 4 Quad meets those high-performance needs while keeping power consumption very low.”
Multi-core processing delivers enhanced performance, enabling users to accomplish more tasks in a shorter period of time. For example, a task such as streaming video can run on one core while the other cores update applications in the background, connecting to the web and scanning virus-check simultaneously.
Benefitting from a use case where the parallel processing and workload sharing among the four cores is necessary, the Exynos 4 Quad is particularly well-suited for heavy-load applications such as 3D games, video editing, and calculation-intensive simulation.
Ericsson has developed a unique solution that triples uplink capacity in HSPA networks. This allows operators with a large number of end users to offer high uplink data speeds.
HSPA is a key means of delivering high-speed, high-capacity mobile broadband, allowing operators to cost-effectively meet user demand for advanced internet services - anywhere, anytime. However, as the number of smartphones connected to a network increases and usage of heavy data-generating applications surges, uplink capacity is becoming more and more important. This is the next important step to meet global smartphone service demands.
On January 25, 2012, Ericsson demonstrated that over-the-air uplink throughput for simultaneously active devices in a cell was increased from around 4Mbps to more than 12Mbps.The demonstrated capacity is an unprecedented figure for a 5 MHz WCDMA carrier.
This was made possible by combining Ericsson's commercially available receiver technology, Ericsson Interference Suppression, with 4-antenna radio base stations. There is no need to upgrade cell phones or consumer devices in order to achieve this gain.
Neonode Inc., is at the forefront of optical touch technologies and provides solutions to several global key manufacturers of touch enabled devices.
Neonode’s new Multi-Sensing technology demonstrates a far more augmented and profound user experience than traditional multi touch. Multi-Sensing is developed to help OEM’s and device manufacturers to differentiate themselves in a competitive market. The Multi-Sensing technology can be implemented into a wide range of commercial devices such as smart phones, tablets and automotive and inflight infotainment systems.
This cutting-edge technology identifies any object and determines its size, the pressure, any depth, the speed and the proximity of an object to a surface. It uses light with zero latency that can sense and determine objects like a pen, brush, bare/gloved finger or larger objects like a hand, at very high speed.
The Multi-Sensing is built on Neonode’s patented optical 2D multi touch solution, zForce, already implemented in millions of proven touch consumer devices in the global market.
Presents first ever demo of HSPA+ Multiflow on commercial infrastructure equipment, delivering up to double the cell edge data speed
Operators will be able to offer enhanced mobile broadband with a new feature for HSPA+ networks from Nokia Siemens Networks and Qualcomm*. Known as HSPA+ Multiflow, it allows devices located close to the edge of a mobile base station’s cell to connect with a second base station serving a neighboring cell. The ‘Multiflow’ name refers to the two different paths data can then take to reach a device. The feature makes far more efficient use of network resources, delivering up to double the data speed and up to 50% faster response compared to existing HSPA+ networks.
A live demonstration** at Mobile World Congress 2012 of the feature will be based on Nokia Siemens Networks’ commercial Single RAN offering and Qualcomm’s prototype USB dongles.
“With 100 million smart devices being added every month, we see a consequent increase in ‘smart’ applications that make use of their advanced capabilities. Not only is network traffic rising dramatically, much of it is also unpredictable in nature, and this can impact user experience,” said Keith Sutton, head of the WCDMA business line for Nokia Siemens Networks. “This is where HSPA+ Multiflow helps operators – it reduces imbalances that typically occur in network resource usage, and increases HSPA+ speed and capacity.”
Qualcomm Incorporated today announced that the Company, working with Ericsson, has successfully completed the first voice call handover from an LTE mobile network to a WCDMA network using Single Radio Voice Call Continuity (SRVCC). An important technology required for voice-over-LTE (VoLTE) support, SRVCC is a 3GPP specified feature that enables continuity of service by seamlessly switching to a WCDMA network when a consumer on a VoLTE call leaves the LTE network’s coverage area. This milestone occurred on December 23, 2011 with an Ericsson network using a handset which incorporated Qualcomm’s Snapdragon™ S4 MSM8960 3G/LTE multimode processor. A demonstration will be available at Qualcomm’s booth at Mobile World Congress in Barcelona, Spain February 27 – March 1, 2012.
“As LTE networks are deployed alongside 3G networks, the ability for multimode 3G/LTE mobile devices to connect to different network technologies will be an important part of providing the best possible mobile voice and data experience to consumers,” said Cristiano Amon, senior vice president of product management, Qualcomm. “Qualcomm is committed to the successful deployment of LTE networks worldwide in conjunction with 3G networks, and the milestone we’ve achieved with Ericsson is another step towards making VoLTE technology a commercial reality.”
Sony Corporation today announced that it has developed a new next-generation back-illuminated CMOS image sensor which embodies the continuous evolution of the camera. This image sensor layers the pixel section containing formations of back-illuminated structure pixels onto chips containing the circuit section for signal processing, which is in place of supporting substrates for conventional back-illuminated CMOS image sensors. This structure achieves further enhancement in image quality, superior functionalities and a more compact size that will lead to enhanced camera evolution.
Hereafter, Sony will position it as the next generation back-illuminated CMOS image sensors, and unwaveringly strive to further develop this image sensor and expand its product lineup, thereby contributing to the further development of user-friendly cameras and to shooting enjoyment.
Synaptics Inc., a leading developer of human interface solutions for mobile computing, communications and entertainment devices, today announced that Design Studio4 (DS4), Synaptics’ ClearPad development solution embedded with patented SignalClarity Technology, is available for customer engagements.
Synaptics DS4 offers the most advanced and comprehensive touch system in the market and accelerates the ClearPad development cycle by empowering customers to evaluate the performance, optimize their touch experience, and efficiently implement their custom ClearPad sensor solution. SignalClarity Technology drives improved tracking accuracy, finger separation, and environmental and electrical noise robustness, for an unmatched user experience. Synaptics combines industry-leading ASICs with DS4 and SignalClarity Technology to offer a complete capacitive touch sensor solution.
SignalClarity Technology provides a dramatic improvement in the signal-to-noise ratio for greatly enhanced touch detection and noise immunity.
AuthenTec, a leading provider of mobile and network security, announced that its AES850 smart fingerprint sensor is now integrated on a new Fujitsu smartphone, the REGZA Phone T-01D Android model now available from NTT DOCOMO, Inc. AuthenTec’s AES850 - the world’s smallest fingerprint matching and navigation device for mobile phones - enhances the features and functionality of the waterproof REGZA Phone T-01D by providing security that locks and unlocks the phone, locks/unlocks user-chosen applications and enhances the speed and security of NFC mobile payments.
AuthenTec’s AES850 helps improve the speed and security of Osaifu-Keitai NFC mobile wallet transactions via fast and highly secure fingerprint authentication on the REGZA Phone T-01D. This helps users conduct quick yet secure mobile wallet transactions via this Android smartphone at more than 500,000 NFC mobile payment terminals in Japan.
Sharp Corporation has developed a 12.1-Megapixel, 1/3.2-inch CMOS camera module with optical image stabilization that features the industry’s thinnest profile (5.47 mm in height). The new RJ63YC100 is intended for use in mobile devices such as smartphones. Sample shipments will begin from December 2, 2011.
The new module’s thin profile has been developed in response to the demand for portable mobile devices with ever more slender designs. The module also addresses the need for embedded cameras in these devices to deliver superior image quality and camera functionality, including connectivity to AV equipment and personal computers.
The optical image stabilizer in this camera module uses a lens-shift system to control the lens inside the module. Sharp’s proprietary high-density packaging technology has made it possible to achieve the industry’s thinnest profile in this type of camera module, which is expected to help reduce the thickness of mobile devices such as smartphones.
Qualcomm Incorporated announced today the expansion of its Snapdragon S4 class of next-generation mobile processors and the enhancement of its Snapdragon S1 solutions for entry-level smartphones.
The addition of new Snapdragon S4 processors, which are aimed at lowering design, engineering and inventory costs while bringing leading-edge 3G and 4G Internet connection speeds, will allow OEMs to introduce S4-based devices with next-generation mobile architecture throughout their respective device roadmaps—from basic smartphones to high-end smartphones and tablets.
Samsung Electronics Co., Ltd., a world leader in advanced semiconductor solutions, announced today its new system-in-package (SIP) near field communications (NFC) chip, the SENHRN1. The new Secu-NFC chip combines a NFC controller and a secure element storing personal information and security keys with advanced encryption technologies, a prerequisite for reliable and efficient mobile payment on NFC-enabled mobile devices. Samsung’s new NFC solution will be on display at CARTES 2011 from November 15th through 17th at the Samsung booth # 3 C 035 in hall 3 at the Paris-Nord Villepinte Exhibition Center.
“Mobile payment, ticketing, data sharing, electronic ID card functions are some of the diverse user services enabled by NFC technology, which is becoming a key service enabler on emerging convergence technologies,” said Dojun Rhee, vice president of System LSI marketing, Device Solutions, Samsung Electronics. “Samsung’s new secure NFC solution with its high data storage capacity provides consumers with ample room to expand operation service and features to deliver the ultimate user experience.”
ARM today announced the ARM Mali-T658 Graphics Processing Unit (GPU) - the latest member of the Midgard architecture-based GPU family targeting high performance devices, such as superphones, tablets and smart-TVs. The Mali-T658 GPU leverages the unique ARM system-level approach to multicore design that optimizes both performance and energy-efficiency. To address high-end consumer requirements, the Mali-T658 GPU delivers up to ten times the graphics performance of the Mali-400 MP GPU, found in a wide range of today’s mainstream consumer products. It also features four times the GPU Compute performance of the Mali-T604 GPU, enabling a raft of new use-cases outside of traditional graphics processing, including computational photography, image-processing and augmented reality.
“Following the recent introduction of big.LITTLE processing and the ARMv8 architecture, the launch of Mali-T658 is another example of how ARM is seeking to redefine heterogeneous computing for the embedded space,” said Jon Peddie, President of specialist graphics research consultancy, Jon Peddie Research. “This will provide high-performance graphics and compute systems for low-power applications.”
NVIDIA today ushered in the era of quad-core mobile computing with the introduction of the NVIDIA Tegra 3 processor, bringing PC-class performance levels, better battery life and improved mobile experiences to tablets and phones. The world's first quad-core tablet with the Tegra 3 processor is the ASUS Eee Pad Transformer Prime.
Known previously by the codename "Project Kal-El," the Tegra 3 processor provides up to 3x the graphics performance of Tegra 2, and up to 61 percent lower power consumption. This translates into an industry-leading 12 hours of battery life for HD video playback.
The Tegra 3 processor implements a new, patent-pending technology known as Variable Symmetric Multiprocessing (vSMP). vSMP includes a fifth CPU "companion," specifically designed for work requiring little power. The four main cores are specifically designed for work requiring high performance, and generally consume less power than dual-core processors.
Corning Incorporated announced the commercial launch of Corning Lotus Glass, an environmentally friendly, high-performance display glass developed to enable cutting-edge technologies, including organic light-emitting diode (OLED) displays and next generation liquid crystal displays (LCD). The company made the announcement at FPD International, an industry trade show in Pacifico Yokohama, Japan, on Oct. 26.
Corning formulated Corning Lotus Glass to perform exceptionally well in low-temperature poly-silicon (LTPS) and oxide thin-film transistor (TFT) backplane manufacturing environments.
Alcatel-Lucent is helping operators of 4G mobile broadband networks create a new conversation experience for their subscribers by introducing a technology innovation that makes it easy to switch between voice and video-calling, instant messaging and group calling and across a variety of devices - smartphone, tablet or PC – at the touch of a button.
Alcatel-Lucent’s new 4G Consumer Communications Solution makes it easier to reach friends or family by eliminating the need to find out what device, service provider or application they might be available on at the time of getting in contact. Subscribers are provided with access to a unified contact list that establishes a single point with which to connect to people, regardless of where they are or what device they’re using.
Broadcom Corporation today unveiled a new family of NFC chips designed to drive the mass deployment of NFC in consumer electronics devices. With a powerful combination of power, size and functional requirements, the new chips provide the advanced capabilities required by OEMs to ignite NFC adoption in consumer electronics. Visit Broadcom.com for more news from the show.
Manufactured in 40 nm CMOS technology, the new Broadcom BCM2079x family slashes power consumption by more than 90 percent, uses 40 percent fewer components and has a 40 percent smaller board area, making it the smallest and most power efficient NFC solution on the market. The NFC controllers are platform agnostic with support for multiple secure elements or SIM cards — or both at the same time. In addition, Broadcom's advanced Maestro middleware allows new NFC applications to utilize Bluetooth and Wi-Fi capabilities in the device to spur new innovations in user interface and media sharing.
SanDisk Corporation, a global leader in flash memory storage solutions, recently unveiled a broad lineup of new retail products and introduced a new preservation solutions category. SanDisk's product portfolio addresses all market segments-from mobile phones and cameras to notebooks and tablets-and use cases ranging from entry level to professional.
"Our flash storage solutions help consumers capture more photos, load their mobile apps faster, share exciting moments with friends and preserve their memories for generations to come," said Bob O'Keefe, vice president, retail marketing, SanDisk.
Preserve the Memories SanDisk Memory Vault: SanDisk introduced a new product that is tested to preserve images in their original quality for up to 100 years1. The SanDisk Memory Vault provides consumers with a convenient, reliable way to pass down their images for generations to come-a photo album for the digital age.
Soon you won't have to worry about recharging your cell phone because it will be automatically recharged as you walk. A company by the name "InStep NanoPower" has developed an inexpensive simple high-power energy harvester that converts mechanical energy to electrical power (up to 20 Watts). The power is more than enough to dramatically extend operational times of mobile electronic devices.
Hot it Works According to InStep NanoPower: "The mechanical energy is converted to electrical energy by a novel microfluidic device through the interaction of thousands of liquid microdroplets with a groundbreaking nanostructured substrate. The most promising application of this technology is to harvest the mechanical energy produced by humans during walking.
Consumers in Sweden were the first in the world to experience commercial LTE services. Today, Ericssondemonstrated the next step of LTE, known as LTE Advanced, to the Swedish Post and Telecom Agency (PTS). The demonstration, held in Kista, Sweden, featured speeds more than 10 times faster than those currently experienced by LTE consumers in Sweden.
The system, based on commercial hardware, was operating on a test frequency provided by the PTS. This enabled Ericsson to demonstrate LTE Advanced functionality such as carrier aggregation of 3 x 20MHz (60MHz aggregated) over the air in a mobile environment for the first time.
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