MEricsson announces the successful trial of its 1Tbps (terabit per second) optical transmission equipment over Telstra's fiber optic network. One terabit is equal to 1000 gigabits.
The successful test over the 995 kilometer optical link between Sydney and Melbourne in Australia shows it is possible to deploy 1Tbps technology in a real network environment. Furthermore, when 1Tbps is commercialized, operators will be in a position to deploy it to meet their capacity requirements.
Telstra Director Transport & Routing Engineering, David Robertson says: "We are currently upgrading our optical transmission networks with Ericsson's next generation 100Gbps technology and this trial demonstrates that the higher 1Tbps speeds are possible.
"The trial has proven that our existing optical cable plant can support Tbps channels along with 40Gbps and 100Gbps channels simultaneously on the same fibre, verifying that we have the ability to increase capacity on our existing fiber cables when required." Alessandro Pane, Head of Ericsson R&D Optical Transmission, says: "Like so many developed countries, Australia is a very technologically advanced market and Australians are sophisticated users of broadband and mobile technology. In addition, there is widespread smart phone, tablet, IPTV and HDTV take-up. Supporting all these services requires an ever-growing capacity in backhaul and inter-city transmission.
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Forging a path for the next wave of advanced, consumer-focused mobile imaging experiences and applications, NVIDIA today announced new capabilities delivered by the NVIDIA Chimera Computational Photography Architecture.
Available in the NVIDIA Tegra 4 family of mobile processors, Chimera architecture offers a number of features never before available on mobile devices, including always-on high-dynamic range (HDR) photos and videos, HDR panoramic and persistent tap-to-track capabilities.
"We developed the Chimera Computational Photography Architecture to take mobile photography far beyond where it is today," said Brian Cabral, Vice President of Computation Imaging at NVIDIA. "We're enabling developers and users to not only use image processing to enhance their photos, but also use computer algorithms to create images no lens can capture alone."
Previous mobile device architectures have made it difficult to use the best tools for different parts of complex image processing. Chimera architecture removes those boundaries by providing the power to conduct nearly 100 billion mathematical operations per second to perform image processing, using computational techniques used in X-ray CT scanners, deep space telescopes and spy satellites.
First revealed at CES 2013, the architecture redefines mobile imaging with always-on HDR photos and videos. This allows camera users to instantly capture high-quality, HDR images similar to how the human eye sees the world -- in a vast array of locations and scenes, and under diverse lighting conditions.
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Corning Incorporated today announced its plans for the International Consumer Electronics Show (CES) in Las Vegas next week. The Corning booth, #14813 Central Hall, will highlight the company’s newest specialty glass solutions and their benefits for today’s consumer electronics device trends.
Corning plans to introduce two new products at CES 2013: Corning Gorilla Glass 3, a new glass composition with durability enhancements; and Optical Cables by Corning, fiber-based, device-to-device connectivity solutions that significantly extend the data transmission range past the limits of copper-based cables. Full product details will be included in announcements planned for Monday, Jan. 7.
“This year at CES, Corning will demonstrate its industry leadership in specialty glass and fiber optic technologies with the introduction of two products designed to enhance and extend the capabilities of consumers’ favorite devices,” said Wendell P. Weeks, chairman, chief executive officer, and president. “These new innovations build on the increasingly important and continually evolving role of highly engineered glass technologies in delivering improved product performance and functionality through touch capabilities, protective cover glass, and device connectivity.”
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Toshiba Corporation will showcase a reference display of an SDHC memory card with TransferJet close proximity wireless transfer technology at the 2013 International CES, to be held from January 8 to 11, 2013, in Las Vegas, U.S.A.
The SDHC memory card on reference display will be a product under development, integrating a TransferJet transceiver IC, a coupler, an RF filter, peripheral passive parts, an SD bridge connection circuit, and Toshiba's NAND flash memory.
Data transfer by TransferJet communications will be implemented in devices supporting SDHC memory cards, such as digital cameras and PCs, by inserting this card in the card slots.
About TransferJet
TransferJet is a close proximity wireless transfer technology standard promoted by the TransferJet Consortium whose membership consists of 45 companies (as of December 28, 2012), including Toshiba. TransferJet technology provides simple connection and high-speed data transfer with low power consumption just by selecting on the screen of a device the data file to be transferred and by touching the receiving device with that device. Applications of TransferJet technology is expected to expand when combined with various devices and technologies, such as digital signage and Near Field Communications (NFC).
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Broadcom Corporation, a global innovation leader in semiconductor solutions for wired and wireless communications, today introduced three new turnkey solutions that enable OEMs to expedite production of 3G smartphones while lowering development costs.
The new platforms are powered by HSPA and HSPA+ processors that have been proven on multiple carrier networks globally and include popular hardware components and software applications that have been tested and accepted by regional operator requirements. By refining the platforms to account for device variations and pre-qualifying hardware component vendors, Broadcom offers multiple customization options and reduces the time to market. This allows handset manufacturers to focus on developing value-added features and affordably deliver a quality Android experience, across multiple smartphone product tiers, in approximately three months or less.
As consumer demand for versatile features like touchscreen functionality, Wi-Fi and location-based services grows, the shift from 2G feature phones to more sophisticated 3G smartphones has accelerated. Analyst firm Ovum predicts that 1.7 billion smartphones will ship by 2017 and cites turnkey solutions by chipset and platform providers as a key factor in helping handset manufacturers meet market demand for entry-level smartphones. | |
Qualcomm Incorporated today announced that its wholly-owned subsidiary, Qualcomm Technologies, Inc., is adding two chipsets to the Qualcomm Snapdragon S4 family of mobile processors, the MSM8226 and MSM8626 chipsets, along with Qualcomm Reference Design versions of both. These Qualcomm Snapdragon S4 processors with quad-core CPUs will bring premium multimedia and connectivity features to high-volume 3G handsets. Featuring the powerful Adreno 305 GPU, 1080p capture and playback, and up to a 13 megapixel camera, the MSM8226 and MSM8626 processors are optimized to deliver visually stunning graphics and exceptionally long battery life to high-volume smartphones. Both processors will be ready for customer sampling by the second quarter of 2013 for UMTS, CDMA and TD-SCDMA.
Building on Qualcomm Technologies’ previous quad-core offering, both the MSM8226 and MSM8626 processors are fabricated using the 28nm technology node and will continue to support multi-SIM capabilities with Dual SIM, Dual Standby; and Dual SIM, Dual Active. In addition to quad-core CPU processing power, these chipsets incorporate the new WTR2605 multi-mode radio transceiver, optimized to address China specific requirements such as support for TD-SCDMA, CDMA 1xAdv and HSPA+. The WTR2605 transceiver comes with an integrated, high-performance GPS core with GLONASS and Beidou support. Optimized for low power consumption, the WTR2605 transceiver offers 40 percent power savings and 60 percent smaller footprint compared to previous generations. | |
Qualcomm Incorporated today announced the addition of two new Snapdragon S4 mobile processors: the MSM8225Q and MSM8625Q. Both are members of the Snapdragon S4 Play processor tier, optimized specifically for a broad range of smartphone users seeking faster applications and better user experiences. Snapdragon S4 Play processors will now offer OEMs both dual-core and quad-core CPUs and performance for entry-level smartphones, with the more advanced version featuring higher bus bandwidth, larger screen resolution support, HD video and enhanced user experiences. Both processors will be ready for customer sampling by end of 2012 and are expected to be shipping in commercial devices in the first quarter of 2013.
The MSM8225Q and MSM8625Q processors incorporate quad-core CPUs and are the upgraded software compatible variants of the highly successful Snapdragon S4 Play MSM8225 and MSM8625 processors, which both feature dual-core CPUs and dual SIM support. The quad-core variants will support LPDDR2 memory, increasing the bus bandwidth for improved features such as 720p display and 720p video encode and decode. Snapdragon S4 Play MSM8625Q features Qualcomm's integrated multimode UMTS/CDMA modem, and the MSM8225Q has an integrated UMTS modem. Both processors enable Wi-Fi, Bluetooth 4.0 and FM connectivity using the Qualcomm Atheros AR6005 and WCN2243 chips.
In addition, Qualcomm also announced a single platform, the Snapdragon S4 Plus MSM8930, that supports all China operators with UMTS, CDMA and TD-SCDMA. Furthermore, this single platform will support LTE-TDD and TD-SCDMA, targeting mid-tier smartphones for use in China. Announced in February 2011, this processor features dual-core CPUs and as the world's first single-chip solution with an integrated LTE modem, it is designed to take LTE to high-volume smartphones. Snapdragon S4 Plus MSM8930 with LTE-TDD and TD-SCDMA support will be ready for customer sampling by the end of 2012 and is expected to be shipping in commercial devices by the first quarter of 2013. | |
Broadcom Corporation, a global innovation leader in semiconductor solutions for wired and wireless communications, today introduced the BCM4335, the industry's first complete 5G WiFi combo chip for smartphones, tablets, ultrabooks and other mobile devices. The new solution furthers Broadcom's wireless connectivity leadership and establishes it as the first chip vendor to sample solutions based on the 802.11ac standard for every major Wi-Fi product segment. For more news, visit Broadcom's Newsroom.
5G WiFi, the 5th generation of Wi-Fi based on the IEEE 802.11ac standard, is a major evolutionary step from the existing 802.11a/b/g/n networks. 5G WiFi dramatically improves the wireless range in the home, allowing consumers to watch HD-quality video from more devices, in more places, simultaneously. With 3X faster speeds, consumers can download web content from a mobile device, and synch large files such as videos, in a fraction of the time it would take on a similar 802.11n device. Since 5G WiFi transfers the same volume of data at a much faster rate, devices enter low-power mode quickly and, as a result, are up to six times more power efficient than equivalent 802.11n solutions.
Broadcom introduced its family of 5G WiFi chips for access points and PCs at CES in January 2012. The world's first 5G WiFi routers and notebooks powered by Broadcom's 5G WiFi chips were introduced to the market in Q2 2012. Smartphones and tablets powered by the new BCM4335, which are expected to hit shelves in Q1 2013, will allow consumers to reap the full speed, range and power saving benefits of 5G WiFi on both ends of the wireless connection. For more information on 5G WiFi, visit www.5GWiFi.org.
Proven Track Record in Combo Technology | |
Antenova Ltd., the integrated antenna and RF solutions company, announced the release of a LTE Antenna Reference Design for Smartphones which covers the global LTE bands. Antenova's extremely wideband and efficient antenna design overcomes the difficulty of covering all the LTE frequency bands without the use of switches or tunable active components, resulting in a significantly lower cost LTE MIMO (Multiple-In-Multiple-Out) antenna system for smartphones.
"LTE is the fastest developing mobile system technology ever and is on every mobile device makers' roadmap, however the goal of a truly global LTE smartphone imposes great challenges on the antenna system," stated Greg McCray, CEO of Antenova. "While the current majority of LTE user devices operate in the 700 MHz band, which has been heavily driven by the U.S. market, rollout of LTE networks in other regions now require devices to operate in the LTE frequency bands utilized in those markets as well. Antenova has been working with Tier 1 smartphone, tablet and notebook vendors and providing them with patented and novel LTE antenna solutions with both custom antenna designs and antenna reference designs."
The A10453 is a fixed frequency LTE antenna that covers LTE 700, GSM850, GSM900, DCS1800, PCS1900, WCDMA2100, LTE B7 (2500-2690 MHz), LTE B38 (2570-2620 MHz), and LTE B40 (2300 - 2400 MHz) bands. When utilized in Antenova's MIMO configuration, the antenna system provides:
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SanDisk Corporation, a global leader in flash memory storage solutions, today announced the world's fastest mobile memory card. The SanDisk Extreme Pro® microSDHC UHS-I card is ideal for smartphone and tablet users who want to boost their device's storage capacity while enjoying the fastest mobile experience.
Maximum Performance for Next-Generation Mobile Devices
The SanDisk Extreme Pro microSDHC UHS-I card enables smartphone and tablet users to fully enjoy their mobile device's advanced applications.
- Full HD Video Capture: Mobile phones will capture approximately one third of all video footage by 2014, according to IDC3. With a UHS Speed Class 1 rating (Class 10 equivalent), the new card allows consumers to record superior Full HD videos, even in 3D
- High-Quality Photo Capture: Mobile phones will capture 525 billion photos in 2012, roughly half of all photos captured this year, according to IDC4. The card is ideal for mobile imaging applications, offering up to 90MB/sec write speed for capturing multiple photos using burst mode with a UHS-I enabled mobile device
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Corning Incorporated announced the launch of Corning Willow Glass, an ultra-slim flexible glass, which could revolutionize the shape and form of next-generation consumer electronic technologies. The company made the announcement today at the Society for Information Display’s Display Week, an industry tradeshow in Boston.
Corning Willow Glass will help enable thin, light and cost-efficient applications including today’s slim displays and the smart surfaces of the future. The thinness, strength, and flexibility of the glass has the potential to enable displays to be “wrapped” around a device or structure. As well, Corning Willow Glass can be processed at temperatures up to 500° C. High temperature processing capability is essential for today’s high-end displays, and is a processing condition that cannot be supported with polymer films. Corning Willow Glass will enable the industry to pursue high-temperature, continuous “roll-to-roll” processes – similar to how newsprint is produced – that have been impossible until now.
It will support thinner backplanes and color filters for both organic light emitting diodes (OLED) and liquid crystal displays (LCD) in high-performance, portable devices such as smartphones, tablets, and notebook computers. This new, ultra-slim flexible glass will also help develop conformable (curved) displays for immersive viewing or mounting on non-flat surfaces. | |
Samsung Electronics Co. Ltd., a world leader in advanced semiconductor solutions, today introduced the industry’s first quad-core application processor built on the High-k Metal Gate (HKMG) low-power process technology. With unprecedented performance capabilities exceeding 1.4GHz based on the ARM® CORTEXTM A9 quad-core, the powerful, yet energy-efficient Exynos 4 Quad, allows system-level architects to integrate maximized power efficiencies into smartphones and tablets which enables double the processing power at a 20 percent lower power bill over its predecessor, the 45nm process-based Exynos 4 Dual.
“The quad-core processor offers phenomenal multitasking abilities surpassing any single or dual application processor. Since all the cores must share a single battery, the power management and efficiency in the limited battery capacity are indispensable for mobile computing devices,” said Taehoon Kim, vice president of System LSI marketing, Device Solutions, Samsung Electronics. “Given the diverse functionalities consumers are demanding from their mobile devices today, the Exynos 4 Quad meets those high-performance needs while keeping power consumption very low.”
Multi-core processing delivers enhanced performance, enabling users to accomplish more tasks in a shorter period of time. For example, a task such as streaming video can run on one core while the other cores update applications in the background, connecting to the web and scanning virus-check simultaneously.
Benefitting from a use case where the parallel processing and workload sharing among the four cores is necessary, the Exynos 4 Quad is particularly well-suited for heavy-load applications such as 3D games, video editing, and calculation-intensive simulation. | |
Ericsson has developed a unique solution that triples uplink capacity in HSPA networks. This allows operators with a large number of end users to offer high uplink data speeds.
HSPA is a key means of delivering high-speed, high-capacity mobile broadband, allowing operators to cost-effectively meet user demand for advanced internet services - anywhere, anytime. However, as the number of smartphones connected to a network increases and usage of heavy data-generating applications surges, uplink capacity is becoming more and more important. This is the next important step to meet global smartphone service demands.
On January 25, 2012, Ericsson demonstrated that over-the-air uplink throughput for simultaneously active devices in a cell was increased from around 4Mbps to more than 12Mbps.The demonstrated capacity is an unprecedented figure for a 5 MHz WCDMA carrier.
This was made possible by combining Ericsson's commercially available receiver technology, Ericsson Interference Suppression, with 4-antenna radio base stations. There is no need to upgrade cell phones or consumer devices in order to achieve this gain.
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Neonode Inc., is at the forefront of optical touch technologies and provides solutions to several global key manufacturers of touch enabled devices.
Neonode’s new Multi-Sensing technology demonstrates a far more augmented and profound user experience than traditional multi touch. Multi-Sensing is developed to help OEM’s and device manufacturers to differentiate themselves in a competitive market. The Multi-Sensing technology can be implemented into a wide range of commercial devices such as smart phones, tablets and automotive and inflight infotainment systems.
This cutting-edge technology identifies any object and determines its size, the pressure, any depth, the speed and the proximity of an object to a surface. It uses light with zero latency that can sense and determine objects like a pen, brush, bare/gloved finger or larger objects like a hand, at very high speed.
The Multi-Sensing is built on Neonode’s patented optical 2D multi touch solution, zForce, already implemented in millions of proven touch consumer devices in the global market. | |
Presents first ever demo of HSPA+ Multiflow on commercial infrastructure equipment, delivering up to double the cell edge data speed
Operators will be able to offer enhanced mobile broadband with a new feature for HSPA+ networks from Nokia Siemens Networks and Qualcomm*. Known as HSPA+ Multiflow, it allows devices located close to the edge of a mobile base station’s cell to connect with a second base station serving a neighboring cell. The ‘Multiflow’ name refers to the two different paths data can then take to reach a device. The feature makes far more efficient use of network resources, delivering up to double the data speed and up to 50% faster response compared to existing HSPA+ networks.
A live demonstration** at Mobile World Congress 2012 of the feature will be based on Nokia Siemens Networks’ commercial Single RAN offering and Qualcomm’s prototype USB dongles.
“With 100 million smart devices being added every month, we see a consequent increase in ‘smart’ applications that make use of their advanced capabilities. Not only is network traffic rising dramatically, much of it is also unpredictable in nature, and this can impact user experience,” said Keith Sutton, head of the WCDMA business line for Nokia Siemens Networks. “This is where HSPA+ Multiflow helps operators – it reduces imbalances that typically occur in network resource usage, and increases HSPA+ speed and capacity.” | |
Qualcomm Incorporated today announced that the Company, working with Ericsson, has successfully completed the first voice call handover from an LTE mobile network to a WCDMA network using Single Radio Voice Call Continuity (SRVCC). An important technology required for voice-over-LTE (VoLTE) support, SRVCC is a 3GPP specified feature that enables continuity of service by seamlessly switching to a WCDMA network when a consumer on a VoLTE call leaves the LTE network’s coverage area. This milestone occurred on December 23, 2011 with an Ericsson network using a handset which incorporated Qualcomm’s Snapdragon™ S4 MSM8960 3G/LTE multimode processor. A demonstration will be available at Qualcomm’s booth at Mobile World Congress in Barcelona, Spain February 27 – March 1, 2012.
“As LTE networks are deployed alongside 3G networks, the ability for multimode 3G/LTE mobile devices to connect to different network technologies will be an important part of providing the best possible mobile voice and data experience to consumers,” said Cristiano Amon, senior vice president of product management, Qualcomm. “Qualcomm is committed to the successful deployment of LTE networks worldwide in conjunction with 3G networks, and the milestone we’ve achieved with Ericsson is another step towards making VoLTE technology a commercial reality.” | |
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