Technology News






Technology News


Introducing Snapdragon LTE Modems and Modem Classes

February 18, 2015 9:31 PM | Technology |

The foundation of great mobile experiences is reliable wireless connectivity. For years, Qualcomm Technologies has provided that foundation with support for superior LTE connectivity in a host of mobile devices through two families of chipsets: Qualcomm Snapdragon processors, and discrete Qualcomm Gobi modems.
Snapdragon LTE modem classes infographic

As our processors have played a critical role in bringing advanced LTE connectivity from the lab to consumers, they help to fulfill the promise of the technology for hundreds of millions of people around the world, and the Snapdragon name has become synonymous with ultra-fast, dependable, LTE connectivity. That’s why, moving forward, our discrete LTE multimode modems—which deliver the same advanced LTE performance in a host of devices from smartphones and PC notebooks to USB modems and personal hotspots—will now share the Snapdragon name.

For example, the Qualcomm Gobi 9x45 modem will now be known as the Qualcomm Snapdragon X12 LTE modem. Which brings us to the other important change we are making.


Qualcomm Snapdragon 810 Processor Powers Premium Tier Mobile Experiences of 2015

February 2, 2015 10:16 PM | Technology |

Qualcomm Incorporated today announced that its subsidiary, Qualcomm Technologies, Inc. (QTI), has a growing customer design pipeline in excess of 60 premium tier mobile devices based on the Qualcomm Snapdragon 810 processor. New devices based on Snapdragon 810 include the LG G Flex2 and the Xiaomi Mi Note Pro, with many more expected in the coming weeks and months.

“The LG Flex2 is designed to represent a new class of innovation at the premium tier with the dynamically curved design, a richer feature set and faster performance than the previous generation,” said Chris Yie, vice president, head of marketing communications at LG Electronics Mobile Communications Company. “With an advanced feature set and stunning multimedia support, the Snapdragon 810 provides us with a tremendous foundation to enable the most advanced mobile experiences for consumers.”

“Xiaomi prides itself on embracing the leading-edge of innovation for premium mobile devices,” said Lei Jun, Founder, chairman and chief executive officer, Xiaomi. “We make every effort to bring the newest and most innovative technology to our enthusiastic customers, drawing on the best in the industry. Our collaboration with Qualcomm Technologies on the Snapdragon 810-powered Mi Note Pro provides us the ability to deliver more performance, features and user capabilities to a mobile device than ever before. This is what our customers want and what Xiaomi will deliver with the Snapdragon 810.”

"Motorola Mobility and Qualcomm have a long history of cooperating to create amazing mobile experiences," said Rick Osterloh, president, Motorola Mobility. "The Snapdragon 810 processor will enable us to push the boundaries even further so we can continue delighting our customers with devices that give them new choices."


Meet the Snapdragon Rover and Snapdragon Micro Rover

October 21, 2014 6:59 PM | Technology |

In the past few years, Qualcomm Research has elevated its investment in bringing innovation to robotics. Last year, we took you inside the Qualcomm Research labs and showed you a robotics project powered by Qualcomm Zeroth—Brain-Inspired computing—which drew a lot of interest. Today we are unveiling more exciting Qualcomm Snapdragon-powered robotics work.

This morning at Uplinq 2014, Qualcomm’s annual developer conference, Qualcomm CEO Steve Mollenkopf demonstrated advances in robotics using two new robots we call the Snapdragon Rover and the Snapdragon Micro Rover.

Snapdragon Rover has learned to classify objects that it sees with its depth-sensing camera. The images from the camera are processed using brain-inspired machine learning techniques known as “deep learning,” which are also provided by Zeroth.

The Snapdragon Micro Rover is a DIY robot for enthusiasts—if you have access to a 3D printer and a smartphone with a Snapdragon processor, you can build it. The smartphone’s Snapdragon processor acts as the robot’s “brains.” Qualcomm Research has made the design tools available at



Broadcom Combo Chip Doubles Wi-Fi Performance for High-end Smartphones and Tablets

September 3, 2014 8:20 PM | Technology |

Broadcom Corporation, a global innovation leader in semiconductor solutions for wired and wireless communications, today announced the industry's most powerful 5G WiFi (802.11ac) 2x2 Multiple Input Multiple Output (MIMO) combo chip for mobile devices. The BCM4358 delivers unparalleled throughput, Bluetooth co-existence performance and indoor location accuracy, enabling OEMs to design high-end smartphones and tablets with twice the Wi-Fi performance. For more news, visit Broadcom's Newsroom.

Today's content-centric consumer spends an average of 4-5 hours a day on Wi-Fi1. With 650 Mbps Wi-Fi data throughput and 50 percent better coexistence performance with Bluetooth, consumers can download content two times faster, stream videos with less buffering and connect to multiple Wi-Fi and Bluetooth devices concurrently (e.g. listen to music while playing a game) without interference issues.  In addition, improved location accuracy down to one meter will allow new and better indoor location-based services to become viable.

"The combination of 5G WiFi and 2x2 MIMO unlocks the full potential of today's smartphones and tablets. These technologies are becoming de facto requirements for connectivity in high-end mobile devices," said David Recker, Broadcom Senior Director, Wireless Connectivity. "With the BCM4358 we are addressing critical multi-radio interference challenges while setting a new bar for performance that reflects Broadcom's continued commitment to be first to deliver the most powerful solutions in the market."

"Broadcom was the first chip vendor to mass produce a 2X2 MIMO combo chip for smartphones and continues to drive adoption of 802.11ac in all consumer electronic segments," said Philip Solis, Research Director, ABI Research. "This second-generation innovation demonstrates Broadcom's continued and substantial lead in 2x2 MIMO technology."


TI Unveils Transmitter Circuit for QI Wireless Charging Stations

January 21, 2014 9:32 PM | Technology |

Texas Instruments today introduced its next-generation wireless power transfer circuit with foreign object detection that will allow designers to bring to market 3-coil, 5-V and 12-V A6 charging stations compliant with the Wireless Power Consortium (WPC) 1.1 specification. The bq500412 controller, which is shipping in volume production, requires half the components compared to other solutions.

Giving smartphone users an improved charging experience, the bq500412 integrates all functions required to control wireless power delivery from the charging station to a receiver circuit used in a Qi-enabled smartphone or other device. In addition to 12-V charging pads, the circuit can be combined with a boost converter to create a 3-coil, 5-V USB charging pad, while taking advantage of a Dynamic Power Limit feature to ensure quality operation independent of the power capability of the port. The bq500412 also supports an enhanced foreign object detection scheme, which makes it easier for designers to implement the requirements of the WPC 1.1 specification.

Features and benefits of bq500412:
  • Complete WPC 1.1 Qi-compliant design for 12-V, A6 charging stations with a minimum 70-mm by 20-mm: bq500412 needs minimal components, including a CSD97374 power stage integrated circuit.
  • Foreign object detection, as mandated by the WPC 1.1 specification, comes standard on the controller, which features an improved algorithm with greater accuracy of error sensing.
  • Intelligent power delivery: TI's Dynamic Power Limit technology allows the transmitter to work from either a USB port or low-power adapter.


Toshiba Ships Industry's First Dual Camera Module

January 7, 2014 9:36 PM | Technology |


Toshiba America Electronic Components, Inc. (TAEC)*, a committed leader that collaborates with technology companies to create breakthrough designs, today makes available sample quantities of its TCM9518MD, the industry's first1 dual camera module able to simultaneously output recorded images and depth data for smartphones, tablets and mobile devices. The TCM9518MD's twin camera modules and a dedicated companion LSI chip simultaneously deliver deep focus images in which foreground and background, and all points in between, are in focus with depth data provided for each object in the picture. The dual camera module will be demonstrated this week at the CES 2014 show in Las Vegas, Nevada.

"We expect the TCM9518MD to drive new applications for smartphone, tablets and mobile devices including refocus and defocus; highlighting objects in a scene and then editing, cropping etc.; as well as image and gesture operation," says Andrew Burt, vice president of the Image Sensor Business Unit, System LSI Group at TAEC. "Not only does the dual camera module enable these advanced capabilities with fast digital focus and little shutter lag, the device doesn't require any focus motors, so it can be built much thinner than today's 13-megapixel camera modules."



Next Generation USB Connection Definition Underway

December 4, 2013 9:32 PM | Technology |

The USB 3.0 Promoter Group today announced that the development of the next generation of USB connector has begun. The new USB Type-C connector, built initially on existing USB 3.1 and USB 2.0 technologies, is being developed to help enable thinner and sleeker product designs, enhance usability and provide a growth path for performance enhancements for future versions of USB. This supplement to the USB 3.1 specification is anticipated to be completed by the middle of next year.

Key characteristics of the USB Type-C connector and cable solution include:
  • An entirely new design tailored to work well with emerging product designs
  • New smaller size – similar in size to the existing USB 2.0 Micro-B
  • Usability enhancements – users will no longer need to be concerned with plug orientation/cable direction, making it easier to plug in
  • The Type-C connector and cable will support scalable power charging
  • Scalability – the connector design will scale for future USB bus performance
As the new USB Type-C plug and receptacle will not directly mate with existing USB plugs and receptacles (Type-A, Type-B, Micro-B, etc.), the Type-C specification will define passive new-to-existing cables and adapters to allow users to use their existing products.


Bluetooth SIG Introduces New Bluetooth 4.1 Specification

December 4, 2013 9:26 PM | Technology |

The Bluetooth SIG introduced the newest update to the core Bluetooth® specification, Bluetooth 4.1. This update is an important evolutionary update to the wireless standard, which received a revolutionary update in 2010 with the introduction of Bluetooth Smart technology. This updated specification aims to improve consumer usability with increased co-existence support for LTE,  efficient data exchange rates, and aid developer innovation by allowing devices to support multiple roles simultaneously. The new release also lays the groundwork for IP-based connections, extending Bluetooth technology’s role as the essential wireless link for the Internet of Things.
  • Improving Usability—extends the brand promise to consumers with an “it just works” experience. This spec is engineered with several new features to make it work seamlessly with popular cell technologies like LTE, maintain connections with less frequent manual reconnection, and deliver a more efficient data exchange.
  • Empowering Developer Innovation—provides developers with greater flexibility to create innovative Bluetooth products and solutions through dual-mode topology and link-layer topology software features.
  • Enabling the Internet of Things—lays the groundwork for IP-based connections by allowing devices to setup a dedicated communication channel in the future thereby extending the central position for Bluetooth technology in the Internet of Things


Qualcomm Announces Next Generation Qualcomm Snapdragon 805 "Ultra HD" Processor

November 20, 2013 9:54 PM | Technology |

Qualcomm Incorporated today announced that its subsidiary, Qualcomm Technologies, Inc., introduced the next generation mobile processor of the Qualcomm® Snapdragon™ 800 tier, the Qualcomm Snapdragon 805 processor, which is designed to deliver the highest-quality mobile video, imaging and graphics experiences at Ultra HD (4K) resolution, both on device and via Ultra HD TVs. Featuring the new Adreno 420 GPU, with up to 40 percent more graphics processing power than its predecessor, the Snapdragon 805 processor is the first mobile processor to offer system-level Ultra HD support, 4K video capture and playback and enhanced dual camera Image Signal Processors (ISPs), for superior performance, multitasking, power efficiency and mobile user experiences.

The Snapdragon 805 processor is Qualcomm Technologies’ newest and highest performing Snapdragon processor to date, featuring:


TI wireless power chip simplifies development of Qi charging stations

September 11, 2013 9:30 PM | Technology |

Building on its industry-leading power management portfolio, Texas Instruments today introduced its next-generation wireless power transfer circuit to support the Wireless Power Consortium (WPC) 1.1 specification. The bq500212A transmitter, which is shipping in volume production, requires one-third fewer components than competitive solutions. The circuit allows designers to quickly take to market Qi-compliant wireless charge pads or stations that can operate from a USB port or 5-V power adapter. To order samples and a development kit, visit:

With more Qi charging stations available in the marketplace, consumers of Qi-enabled smartphones, smartwatches and many other "enclosed" portable consumer electronics will be able to keep their batteries charged longer. Products like the Kickstarter-born AGENT Smartwatch are using TI's bqTESLA™ wireless power products, including the bq500212A and a bq51050B receiver, to ensure wireless power capability.

"AGENT Smartwatches need to be water resistant, and consumers shouldn't need to worry about plugging their watches into a charging adapter day after day," said Chris Walker, founder of Secret Labs. "TI's wireless power products give our customers the ability to simply set their AGENT Smartwatch on the included Qi charging pad (or any other Qi-compliant charging pad) from time to time to keep the battery topped off. No wires, no hassle."

Features and benefits of bq500212A:



Qualcomm Expands Qualcomm Snapdragon 200 Processor Tier

June 20, 2013 8:17 PM | Technology |

Qualcomm Incorporated today announced that its wholly-owned subsidiary, Qualcomm Technologies, Inc., has expanded its entry-level offerings with the addition of six new processors to its Qualcomm Snapdragon 200 class, featuring dual- and quad- core CPUs. The new Snapdragon 200 processors are manufactured on a 28nm process technology and feature key modem technologies that are important in China and emerging regions, including support for HSPA+ (up to 21Mbps) and TD-SCDMA. It is anticipated that the new processors (8x10 and 8x12), along with its Qualcomm Reference Design counterparts, will be available in late 2013 and are designed to deliver improved performance, graphics-rich gaming experience and advanced multimedia features for high-volume smartphones.

“With the expanded line of Snapdragon 200 processors, Qualcomm Technologies is building on its dual-and quad-core processor portfolio for entry-level smartphones and tablets, bringing key process technology and modem features to all Snapdragon tiers,” said Jeff Lorbeck, senior vice president of product management, Qualcomm Technologies, Inc. “We are excited to offer our customers the broadest range of 3G technologies and superior performance and power-efficiency, enabling them to deliver a wide range of innovative smartphones for the high-volume segment.”


LG & Qualcomm Expands Collaboration with Next G Series Smartphone

June 20, 2013 8:10 PM | Technology |

Expanding on a collaboration with a proven track record of success, LG Electronics, Inc. (LG), Qualcomm Incorporated, and its wholly-owned subsidiary, Qualcomm Technologies, Inc., today announced that the successor to the award-winning LG Optimus will utilize Qualcomm® Snapdragon 800 processor, the industry’s most advanced mobile chipset. Qualcomm Snapdragon is a product of Qualcomm Technologies, Inc.

LG’s G series device powered by Qualcomm Snapdragon 800 processors will redefine the smartphone experience through stunning performance, rich graphics and outstanding battery efficiency. Capable of carrier aggregation, the Snapdragon 800 processor is designed to allow LTE to be even faster by maximizing spectrum bandwidth to increase data speeds and reduce latency.

“With a powerful combination of LG’s core smartphone technologies and the Qualcomm Snapdragon 800 processor, we are taking a significant step forward in the mobile experience,” said Dr. Jong-seok Park, president and CEO of LG Electronics Mobile Communications Company. “The result of this collaboration will in many ways be the industry’s best smartphone by which all other devices will be measured.”

“We are pleased with our continued collaboration with LG,” said Murthy Renduchintala, executive vice president, Qualcomm Technologies, Inc. and co-president, Qualcomm mobile and computing. “Fully tailored and tightly integrated with the entire next G series platform, the new, best-in-class Qualcomm Snapdragon 800 processor will help deliver blazing fast web browsing, eye-popping graphics, seamless connectivity as well as an unmatched multimedia experience.”


Broadcom Introduces New Quad-Core HSPA+ Processor

June 13, 2013 7:48 PM | Technology |

Broadcom Corporation (BRCM), a global innovation leader in semiconductor solutions for wired and wireless communications, today announced a quad-core HSPA+ processor designed for high-performance, entry-level smartphones. The BCM23550 is the company's newest smartphone platform optimized for the Android 4.2 Jelly Bean operating system (OS). For more news, visit Broadcom's Newsroom.

According to research firm International Data Corporation (IDC), the first quarter of 2013 marked the first time that smartphones comprised more than half of all phones shipped globally.1 This growth is driven by mass market consumers who demand affordable devices that deliver increased functionality and a level of performance that was previously available only in higher-end superphones. The BCM23550, and its turnkey design, are powered by a quad-core processor running at 1.2GHz, VideoCore multimedia and an integrated HSPA+ cellular baseband that provides enhanced, power-efficient features for entry-level smartphones.

"Broadcom's new quad-core solution allows OEMs to deliver the multi-tasking, graphics-rich capabilities required in today's smartphones, while still appealing to consumers seeking superior performance at affordable prices," said Rafael Sotomayor, Broadcom Vice President, Product Marketing, Mobile Platform Solutions. "By combining the performance benefits of a quad-core solution with high-end features like 5G WiFi, globally certified NFC technology, and advanced indoor positioning technology, the platform offers device manufacturers a flexible and cost-effective path to address the affordable smartphone segment."


Aviacomm and WiMatek Collab on LTE Machine to Machine Chipsets and Modules

June 3, 2013 9:57 PM | Technology |

Leading wideband RFIC vendor Aviacomm Inc. and WiMatek Systems Inc. announced today that the two companies will work together in development and integration of Aviacomm's Smart Analog Solution technology with WiMatek's LTE baseband solution. The resultant module will form a complete LTE based communications platform targeting the emerging machine to machine market (M2M).

As LTE coverage expands on a daily basis, secondary use of the network to support machine to machine communications is fast becoming an additional revenue stream for operators around the world. Existing LTE baseband and radio solutions target smart phones and other end user devices, burdening an M2M solution with features and functionality that do little to serve the application, and increase power consumption.

Aviacomm's advanced broadband programmable RFIC, the ARF1010EX, integrated with WiMatek's low power LTE baseband, will deliver to the market a single hardware module that can support all LTE bands around the globe for M2M applications. The module, with its small size, low power and single version supporting all LTE bands, will release M2M vendors from the frequency fragmentation quagmire of LTE.


LTE and Smartphone Uptake Drives Video Traffic Growth

June 3, 2013 9:54 PM | Technology |

The new edition of the Ericsson (ERIC) Mobility Report reveals that mobile-data traffic will continue to grow significantly in the coming years, a trend driven mainly by video. Overall data traffic is expected to grow 12-fold by the end of 2018. Increasing usage is driven by continual growth in the amount of content available as well as the improved network speeds that come with HSPA and LTE development.

Douglas Gilstrap , Senior Vice President and Head of Strategy at Ericsson, says: "LTE services will be available to about 60 percent of the world's population in 2018. We expect LTE subscriptions to exceed 1 billion in 2017, driven by more capable devices and demand for data-intensive services such as video. Owing to the build out of WCDMA/HSPA, network speeds have improved, and so has the user experience."

Video makes up the largest segment of data traffic in networks, and it is expected to grow around 60 percent annually up until the end of 2018. Video consumption is on average 2.6GB per subscription per month in some networks.

While video is popular, users don't necessarily tend to spend the most time on data-heavy applications. Consumers spend more time on social networking: an average of up to 85 minutes per day in some networks.


Qualcomm Integrates Multimode 3G/4G LTE into Qualcomm Snapdragon 400 Processors

June 3, 2013 9:50 PM | Technology |

Qualcomm Incorporated today announced that its wholly-owned subsidiary, Qualcomm Technologies, Inc., is expanding the offering of its Qualcomm Snapdragon 400 processors with the introduction of its newest processor, featuring quad-core CPUs with integrated multimode 3G/4G LTE. This makes the Snapdragon 400 tier the first to offer multimode 3G/4G LTE on processors with both dual-and quad-core CPUs for high-volume smartphones. In addition to multimode 3G/4G LTE, the processor integrates key modem features that are important to China and other emerging regions, including TD-SCDMA, HSPA+ (up to 42Mbps), and multi-SIM capabilities. The new Snapdragon 400 processor (8926), along with its Qualcomm Reference Design counterpart, will be available in late 2013 and will deliver the optimal balance of multimedia features, modem technologies and performance to high-volume smartphones.

“By offering a multimode 3G/4G LTE variant to Qualcomm Snapdragon 400 tier of processors with quad-core CPUs, we are ensuring that emerging regions are equipped and prepared for the imminent transition to multimode 3G/4G LTE, in addition to being equipped for every major 2G and 3G technology,” said Cristiano Amon, executive vice president and co-president of mobile and computing products, Qualcomm Technologies. “Snapdragon 400 processors provide customers with a wide range of innovative smartphones for both the high-volume and mid-tier segments.”


BSQUARE Announces Next Gen Mobile Development Platform

May 29, 2013 7:33 PM | Technology |

BSQUARE today announced general availability of its next generation Mobile Development Platform (MDP), which is based on the Qualcomm Snapdragon 800 (8974) processor by Qualcomm Technologies, Inc. This MDP will be released in both a tablet and smartphone form factor by Bsquare and is designed to provide application developers and device manufacturers with access to the high-performance Android 4.2 platform for developing, testing, optimizing and showcasing applications and games.

Complete with asynchronous quad-core Krait 400 CPUs, this latest MDP based on Qualcomm Technologies' Snapdragon 800 processor will also include an Adreno 330 GPU, Hexagon v5 QDSP6 and other advanced multimedia technologies. An essential tool for developers, component suppliers, manufacturers, operators and other industry participants, this MDP features integrated hardware and software, which aids in simplifying and accelerating development efforts. In addition, this MDP will provide users the ability to test and optimize applications and devices prior to commercial device deployment.

The smartphone form factor for this MDP features a 4.3" 720p HD multi-touch display, while the tablet form factor version features an 11.6" 1080p HD multi-touch display. Both of these form factors also feature UltraHD/4K video support via HDMI output and are one of the first mobile development platforms to include both USB 3.0, and 802.11ac Wi-Fi for quick file transfers, and streaming rates up to 1.3Gbps.



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